Information
Application：
VFP series is a new generation of via-filling solution which also apply to VCP equipment, with high speed blind hole filling capacity suitable for hole diameter of 2~6mil and thinner surface copper, it’s fully applied for the production of fine lines, high current, high through hole plating, as well as simultaneously through hole and blind hole plating meanwhile through hole have good corner throwing power.
Advantage introduction：
Metal Compounds
PCB Solutions
Chemical Reagents
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